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1. general description the 74lvt16244b; 74lvth16244b is a high-performance bicmos product designed for v cc operation at 3.3 v. this device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs. the device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. 2. features n 16-bit bus interface n 3-state buffers n output capability: +64 ma and - 32 ma n ttl input and output switching levels n input and output interface capability to systems at 5 v supply n bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs n power-up 3-state n live insertion and extraction permitted n no bus current loading when output is tied to 5 v bus n latch-up protection u jesd78 class ii exceeds 500 ma n esd protection: u hbm jesd22-a114e exceeds 2000 v u mm jesd22-a115-a exceeds 200 v 3. ordering information 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state rev. 06 13 november 2008 product data sheet table 1. ordering information type number package temperature range name description version 74lvt16244bdl - 40 c to +85 c ssop48 plastic shrink small outline package; 48 leads; body width 7.5 mm sot370-1 74lvth16244bdl 74lvt16244bdgg - 40 c to +85 c tssop48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm sot362-1 74lvth16244bdgg 74lvt16244bev - 40 c to +85 c vfbga56 plastic very thin ?ne-pitch ball grid array package; 56 balls; body 4.5 7 0.65 mm sot702-1 74lvt16244bbq - 40 c to +125 c huqfn60u plastic thermal enhanced ultra thin quad ?at package; no leads; 60 terminals; utlp based; body 4 x 6 x 0.55 mm sot1025-1 74LVTH16244BBQ
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 2 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 4. functional diagram pin numbers are shown for ssop48 and tssop48 packages only. pin numbers are shown for ssop48 and tssop48 packages only. fig 1. logic symbol fig 2. iec logic symbol 001aae506 47 46 44 43 2 3 5 6 1a0 1a1 1a2 1a3 1y0 1y1 1y2 1y3 1 1oe 36 35 33 32 13 14 16 17 3a0 3a1 3a2 3a3 3y0 3y1 3y2 3y3 25 3oe 30 29 27 26 19 20 22 23 4a0 4a1 4a2 4a3 4y0 4y1 4y2 4y3 24 4oe 41 40 38 37 8 9 11 12 2a0 2a1 2a2 2a3 2y0 2y1 2y2 2y3 48 2oe 1 1 1 1 1 3 2 4 001aae231 33 32 30 29 27 26 16 17 19 20 22 23 47 46 44 43 41 40 38 37 36 35 2 3 5 6 8 9 11 12 13 14 24 25 1a0 1a1 1a2 1a3 2a0 2a1 2a2 2a3 3a0 3a1 3a2 3a3 4a0 4a1 4a2 4a3 1y0 1y1 1y2 1y3 2y0 2y1 2y2 2y3 3y0 3y1 3y2 3y3 4y0 4y1 4y2 4y3 48 1 4oe 1oe 2oe 3oe en1 en2 en3 en4
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 3 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 5. pinning information 5.1 pinning fig 3. pin con?guration sot370-1 (ssop48) and sot362-1 (tssop48) fig 4. pin con?guration sot702-1 (vfbga56) 74lvt16244b 74lvth16244b 1oe 2oe 1y0 1a0 1y1 1a1 gnd gnd 1y2 1a2 1y3 1a3 v cc v cc 2y0 2a0 2y1 2a1 gnd gnd 2y2 2a2 2y3 2a3 3y0 3a0 3y1 3a1 gnd gnd 3y2 3a2 3y3 3a3 v cc v cc 4y0 4a0 4y1 4a1 gnd gnd 4y2 4a2 4y3 4a3 4oe 3oe 001aae507 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 001aaj057 74lvt16244b 74lvth16244b transparent top view k j h g f e c b a d 246 135 ball a1 index area
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 4 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 5.2 pin description (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as a supply pin or input. fig 5. pin con?guration sot1025-1 (huqfn60u) d1 d3 a16 a15 a14 a13 a12 a11 d2 b9 b10 d7 a17 a18 b11 a19 b12 a20 b13 a21 b14 b8 a10 d6 a9 a8 b7 b6 a7 b5 a6 a22 b15 a23 b16 a24 b17 a25 a26 d8 d4 a27 b18 a28 a29 b19 b20 a30 a31 a32 b4 a5 b3 b2 b1 d5 a4 a3 a2 a1 74lvt16244b 74lvth16244b 001aaj056 transparent top view gnd (1) terminal 1 index area table 2. pin description symbol pin description sot370-1 and sot362-1 sot702-1 sot1025-1 1 oe, 2 oe, 3 oe, 4 oe 1, 48, 25, 24 a1, a6, k6, k1 a30, a29, a14, a13 output enable input (active low) 1y0 to 1y3 2, 3, 5, 6 b2, b1, c2, c1 b20, a31, d5, d1 data output 2y0 to 2y3 8, 9, 11, 12 d2, d1, e2, e1 a2, b2, b3, a5 data output 3y0 to 3y3 13, 14, 16, 17 f1, f2, g1, g2 a6, b5, b6, a9 data output 4y0 to 4y3 19, 20, 22, 23 h1, h2, j1, j2 d2, d6, a12, b8 data output
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 5 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 6. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 7. limiting values gnd 4, 10, 15, 21, 28, 34, 39, 45 b3, b4, d3, d4, g3, g4, j3, j4 a32, a3, a8, a11, a16, a19, a24, a27 ground (0 v) v cc 7, 18, 31, 42 c3, c4, h3, h4 a1, a10, a17, a26 supply voltage 1a0 to 1a3 47, 46, 44, 43 b5, b6, c5, c6 b18, a28, d8, d4 data input 2a0 to 2a3 41, 40, 38, 37 d5, d6, e5, e6 a25, b16, b15, a22 data input 3a0 to 3a3 36, 35, 33, 32 f6, f5, g6, g5 a21, b13, b12, a18 data input 4a0 to 4a3 30, 29, 27, 26 h6, h5, j6, j5 d3, d7, a15, b10 data input n.c. - a2, a3, a4, a5, k2, k3, k4, k5 a4, a7, a20, a23, b1, b4, b7, b9, b11, b14, b17, b19 not connected table 2. pin description continued symbol pin description sot370-1 and sot362-1 sot702-1 sot1025-1 table 3. function table [1] control input output n oe nan nyn lll lhh hxz table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +4.6 v v i input voltage [1] - 0.5 +7.0 v v o output voltage output in off-state or high-state [1] - 0.5 +7.0 v i ik input clamping current v i < 0 v - 50 - ma i ok output clamping current v o < 0 v - 50 - ma i o output current output in low-state - 128 ma output in high-state - 64 - ma t stg storage temperature - 65 +150 c t j junction temperature [2] - 150 c
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 6 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state [1] the input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] the performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create j unction temperatures which are detrimental to reliability. [3] above 60 c the value of p tot derates linearly with 5.5 mw/k. [4] above 70 c the value of p tot derates linearly with 1.8 mw/k. 8. recommended operating conditions p tot total power dissipation t amb = - 40 c to +125 c; (t)ssop48 package [3] - 500 mw vfbga56 package [4] - 1000 mw huqfn60u package [4] - 1000 mw table 4. limiting values continued in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit table 5. recommended operating conditions symbol parameter conditions min typ max unit v cc supply voltage 2.7 - 3.6 v v i input voltage 0 - 5.5 v v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.8 v i oh high-level output current - 32 - - ma i ol low-level output current none - - 32 ma current duty cycle 50 %; f i 3 1 khz - - 64 ma t amb ambient temperature in free-air - 40 - +85 c d t/ d v input transition rise and fall rate outputs enabled - - 10 ns/v
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 7 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 9. static characteristics table 6. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit t amb = - 40 c to +85 c [1] v ik input clamping voltage v cc = 2.7 v; i ik = - 18 ma - 1.2 - 0.85 - v v oh high-level output voltage i oh = - 100 m a; v cc = 2.7 v to 3.6 v v cc - 0.2 v cc -v i oh = - 8 ma; v cc = 2.7 v 2.4 2.5 - v i oh = - 32 ma; v cc = 3.0 v 2.0 2.3 - v v ol low-level output voltage v cc = 2.7 v i ol = 100 m a - 0.07 0.2 v i ol = 24 ma - 0.3 0.5 v v cc = 3.0 v i ol = 16 ma - 0.25 0.4 v i ol = 32 ma - 0.3 0.5 v i ol = 64 ma - 0.4 0.55 v i i input leakage current all input pins; v cc = 0 v or 3.6 v; v i = 5.5 v - 0.4 10 m a control pins; v cc = 3.6 v; v i =v cc or gnd - 0.1 1.0 m a data pins; v cc = 3.6 v [2] v i =v cc - 0.1 1 m a v i =0v - - 0.4 - 5 m a i off power-off leakage current v cc = 0 v; v i or v o = 0 v to 4.5 v - 0.1 100 m a i bhl bus hold low current v cc = 3 v; v i = 0.8 v [3] 75 135 - m a i bhh bus hold high current v cc = 3 v; v i = 2.0 v -- 135 - 75 m a i bhlo bus hold low overdrive current nan input; v cc = 0 v to 3.6 v; v i = 3.6 v 500 - - m a i bhho bus hold high overdrive current nan input; v cc = 0 v to 3.6 v; v i = 3.6 v - - - 500 m a i hold bus hold current data input v cc = 3 v [3] v i = 0.8 v 75 135 - m a v i = 2.0 v - - 135 - 75 m a v cc = 0 v to 3.6 v v i = 3.6 v 500 - - m a i lo output leakage current output in high-state when v o >v cc ; v o = 5.5 v; v cc = 3.0 v - 50 125 m a i o(pu/pd) power-up/power-down output current v cc 1.2 v; v o = 0.5 v to v cc ;v i = gnd or v cc ; n oe = dont care [4] -1 100 m a i oz off-state output current v cc = 3.6 v; v i = v ih or v il output high: v o = 3.0 v - 0.5 5 m a output low: v o = 0.5 v - +0.5 - 5 m a
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 8 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state [1] typical values are measured at v cc = 3.3 v and at t amb = 25 c. [2] unused pins at v cc or gnd. [3] this is the bus hold overdrive current required to force the input to the opposite logic state. [4] this parameter is valid for any v cc between 0 v and 1.2 v with a transition time of up to 10 ms. from v cc = 1.2 v to v cc = 3.3 v 0.3 v a transition time of 100 m s is permitted. this parameter is valid for t amb = 25 c only. [5] i cc is measured with outputs pulled to v cc or gnd. [6] this is the increase in supply current for each input at the speci?ed voltage level other than v cc or gnd. 10. dynamic characteristics [1] typical values are measured at v cc = 3.3 v and t amb = 25 c. i cc supply current v cc = 3.6 v; v i = gnd or v cc ; i o =0a output high - 0.07 0.12 ma output low - 4.0 6.0 ma outputs disabled [5] - 0.07 0.12 ma d i cc additional supply current per input pin; v cc = 3.0 v to 3.6 v; one input at v cc - 0.6 v other inputs at v cc or gnd [6] - 0.1 0.2 ma c i input capacitance v i = 0 v or 3.0 v - 3 - pf c o output capacitance outputs disabled; v o = 0 v or 3.0 v - 9 - pf table 6. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min typ max unit table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 8 . symbol parameter conditions min typ max unit t amb = - 40 c to +85 c [1] t plh low-to-high propagation delay nan to nyn; see figure 6 v cc = 2.7 v - - 4.0 ns v cc = 3.0 v to 3.6 v 0.5 1.8 3.2 ns t phl high-to-low propagation delay nan to nyn; see figure 6 v cc = 2.7 v - - 4.0 ns v cc = 3.0 v to 3.6 v 0.5 1.7 3.2 ns t pzh off-state to high propagation delay n oe to nyn; see figure 7 v cc = 2.7 v - - 5.0 ns v cc = 3.0 v to 3.6 v 1.0 2.3 4.0 ns t pzl off-state to low propagation delay n oe to nyn; see figure 7 v cc = 2.7 v - - 5.3 ns v cc = 3.0 v to 3.6 v 1.0 2.1 4.0 ns t phz high to off-state propagation delay n oe to nyn; see figure 7 v cc = 2.7 v - - 5.0 ns v cc = 3.0 v to 3.6 v 1.0 3.2 4.5 ns t plz low to off-state propagation delay n oe to nyn; see figure 7 v cc = 2.7 v - - 4.4 ns v cc = 3.0 v to 3.6 v 1.0 2.9 4.0 ns
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 9 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 11. waveforms measurements points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. propagation delay input (nan) to output (nyn) mna171 nan input nyn output t plh t phl gnd v i v m v m v m v m v oh v ol measurements points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 7. 3-state output enable and disable times 001aae464 t pzl nyn output nyn output noe input v ol v oh 3.0 v v i v m gnd 0 v t plz t pzh t phz v x v y v m v m table 8. measurement points input output v m v m v x v y 1.5 v 1.5 v v ol + 0.3 v v oh - 0.3 v
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 10 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state test data is given in t ab le 9 . de?nitions test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 8. load circuit for measuring switching times v ext v cc v i v o 001aae235 dut c l r t r l r l pulse generator v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f table 9. test data input load v ext v i f i t w t r , t f c l r l t phz , t pzh t plz , t pzl t plh , t phl 2.7 v 10 mhz 500 ns 2.5 ns 50 pf 500 w gnd 6 v open
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 11 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 12. package outline fig 9. package outline sot370-1 (ssop48) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.4 0.2 2.35 2.20 0.25 0.3 0.2 0.22 0.13 16.00 15.75 7.6 7.4 0.635 1.4 0.25 10.4 10.1 1.0 0.6 1.2 1.0 0.85 0.40 8 0 o o 0.18 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot370-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 48 25 mo-118 24 1 q a a 1 a 2 l p q detail x l (a ) 3 pin 1 index 0 5 10 mm scale ssop48: plastic shrink small outline package; 48 leads; body width 7.5 mm sot370-1 a max. 2.8
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 12 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state fig 10. package outline sot362-1 (tssop48) unit a 1 a 2 a 3 b p cd (1) e (2) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.2 0.1 8 0 o o 0.1 dimensions (mm are the original dimensions). notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. sot362-1 99-12-27 03-02-19 w m q a a 1 a 2 d l p q detail x e z e c l x (a ) 3 0.25 124 48 25 y pin 1 index b h 1.05 0.85 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 1 0.25 8.3 7.9 0.50 0.35 0.8 0.4 0.08 0.8 0.4 p e v m a a tssop48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm sot362-1 a max. 1.2 0 2.5 5 mm scale mo-153
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 13 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state fig 11. package outline sot702-1 (vfbga56) 0.65 a 1 b a 2 unit d y e references outline version european projection issue date 02-08-08 03-07-01 iec jedec jeita mm 1 0.3 0.2 0.7 0.6 4.6 4.4 y 1 7.1 6.9 0.45 0.35 0.08 0.1 e 1 3.25 e 2 5.85 dimensions (mm are the original dimensions) sot702-1 mo-225 e 0.15 v 0.08 w 0 2.5 5 mm scale sot702-1 vfbga56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm a max. a a 2 a 1 detail x y y 1 c e e b x d e c a b c d e f h g j k 246 135 ball a1 index area b a e 2 e 1 1/2 e 1/2 e a c c b ? v m ? w m ball a1 index area
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 14 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state fig 12. package outline sot1025-1 (huqfn60u) references outline version european projection issue date iec jedec jeita sot1025-1 - - - - - - - - - sot1025-1 unit a max mm 0.6 0.05 0.00 0.35 0.25 1.9 1.8 6.1 5.9 3.9 3.8 0.5 2.5 3 0.5 0.07 0.05 a 1 dimensions (mm are the original dimensions) huqfn60u: plastic thermal enhanced ultra thin quad flat package; no leads 60 terminals; utlp based; body 4 x 6 x 0.55 mm b d 4.1 3.9 d h e e h e e 1 1 e 2 e 3 e 4 4.5 er k 0.25 0.15 l 0.35 0.25 l 1 0.125 0.025 v wy 1 0.1 y 0.08 0 2.5 5 mm scale c y c y 1 x terminal 1 index area b a d e detail x a a 1 terminal 1 index area e 2 e 3 e 4 e 1 er e e 1/2 e 1/2 e b l 1 l a c b v m c w m d5 a1 b1 b7 a10 a11 b8 b10 a16 a32 b20 b18 a27 a26 b17 b11 a17 d1 d4 d2 d3 d6 d8 d7 d h e h k a c b v m c w m 07-08-28 07-11-14
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 15 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 13. abbreviations 14. revision history table 10. abbreviations acronym description bicmos bipolar complementary metal oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74lvt_lvth16244b_6 20081113 product data sheet - 74lvt_lvth16244b_5 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? added type number 74lvt16244bbq and 74LVTH16244BBQ (huqfn60u package) 74lvt_lvth16244b_5 20060321 product data sheet - 74lvt16244b_4 74lvt16244b_4 20021031 product speci?cation - 74lvt16244b_3 74lvt16244b_3 19981007 product speci?cation - 74lvt16244b_2 74lvt16244b_2 19980219 product speci?cation - -
74lvt_lvth16244b_6 ? nxp b.v. 2008. all rights reserved. product data sheet rev. 06 13 november 2008 16 of 17 nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state 15. legal information 15.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 15.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 15.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 15.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 16. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74lvt16244b; 74lvth16244b 3.3 v 16-bit buffer/driver; 3-state ? nxp b.v. 2008. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 13 november 2008 document identifier: 74lvt_lvth16244b_6 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 17. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 functional description . . . . . . . . . . . . . . . . . . . 5 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 recommended operating conditions. . . . . . . . 6 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 7 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 15 legal information. . . . . . . . . . . . . . . . . . . . . . . 16 15.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 15.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 contact information. . . . . . . . . . . . . . . . . . . . . 16 17 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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